Vertiv (NYSE: VRT) unveiled a suite of rack, power, and cooling technologies designed to meet Open Compute Project (OCP) guidelines, supporting high-density, energy-efficient AI and data center environments. These innovations will be showcased at the 2025 OCP Global Summit, October 13–16, Booth #C34.
Vertiv’s offerings include:
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SmartIT OCP Rack Solution – Configurable high-capacity racks supporting loads up to 142 kW with integrated, validated power and cooling.
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PowerIT Rack PDUs – Monitored and switched units delivering up to 57.6 kW, with advanced load balancing, management, and cybersecurity features.
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PowerBar Track – Modular overhead power distribution for high-density AI and HPC workloads, simplifying installation and optimizing space.
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CoolChip Fluid Network Manifolds – Liquid cooling solutions for efficient thermal management in dense AI environments.
Additionally, Harting connectivity and cabling solutions demonstrate compact, high-performance integration, emphasizing Vertiv’s commitment to open standards and seamless deployment.
Ramesh Menon, VP of IT Systems at Vertiv, stated, “Meeting OCP standards is more than compliance—it’s delivering infrastructure that performs at scale. Our integrated ecosystem provides customers a faster, reliable path to AI-ready capacity.”
Vertiv’s presence at the summit underscores its focus on open, vendor-neutral systems, modular designs, and AI-assisted planning to meet the evolving needs of modern data centers.
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