RiseLink Convenes the Physical AI Ecosystem at CES 2026, Advancing Intelligence From Silicon to Shipping Products

RiseLink Technologies convened leaders from across the physical AI ecosystem at CES 2026 in Las Vegas, highlighting how intelligence is rapidly moving beyond the cloud and into real-world, connected devices. Through curated discussions and live demonstrations, the company showcased how edge AI, ultra-low-power connectivity, and system-level integration are shaping the next generation of AI-native products.

Aligning the Physical AI Stack

At the center of RiseLink’s CES presence was an invitation-only gathering titled “The Blueprint for Physical AI: AI-Native Hardware Mixer.” The session brought together founders, product leaders, and platform partners spanning AI models, device platforms, and deployment ecosystems. Participants included companies such as MiniMax, Agora, Wyze, Nanit, Luka AI, WowCube, Fuzozo, and Dify, all focused on transitioning AI from cloud-centric architectures to intelligent, production-ready devices.

Edge Intelligence Enabling Real-World AI

Discussions emphasized that successful physical AI products depend on the convergence of on-device intelligence, ultra-low-power connectivity, and system-level design. These capabilities are increasingly critical across applications including smart homes, robotics, AI companions, and educational devices, where responsiveness, reliability, and energy efficiency directly impact user experience.

From Ecosystem Alignment to a Shipping Product

RiseLink demonstrated this ecosystem approach through the introduction of ChooChoo, an AI-powered early education toy created and presented by Dr. Diana Zhu, Head of U.S. at RiseLink Technologies. Designed to support early language development through interactive reading and storytelling, ChooChoo runs intelligence closer to the device, enabling always-on interaction while prioritizing privacy, safety, and trust.

Demonstrating the Physical AI Model in Practice

ChooChoo serves as a tangible example of how the physical AI stack comes together — combining edge-optimized AI algorithms, power-efficient hardware, and integrated system design. The product illustrates how AI-native devices can move efficiently from concept to scalable deployment when silicon, software, and product development are aligned from the outset.

Building a Collaborative Physical AI Ecosystem

Throughout CES 2026, RiseLink reinforced its role as a connector within the physical AI ecosystem. The company is actively collaborating with AI model developers, smart device manufacturers, and platform partners to accelerate the transition from prototype to production. By enabling deeper collaboration across hardware and software layers, RiseLink aims to support a new generation of intelligent devices designed for life beyond the screen.